MEMS Foundry
STANDARD THIN
FILM PROCESSES
|
PLATINUM SILICIDE, PALLADIUM SILICIDE |
TiW/Au METALLIZATIONS FOR BIPOLAR AND DMOS, LDMOS RF DEVICES |
Ti/Ni/Ag BACKSIDE METALLIZATIONS FOR SOFT SOLDER DIE ATTACHING |
Ti/Ni/Ag DEPOSITION and LIFT-OFF PROCESS |
Ti/Pd/Au DEPOSITION and LIFT-OFF PROCESS |
Au BACKSIDE METALLIZATIONS |
Au BUMP PROCESS FOR FLIP CHIP APPLICATIONS |
SOLDER BUMP PROCESS FOR FLIP CHIP APPLICATONS |
HTELabs, 2964-2966 Scott Blvd. Santa Clara, CA 95054 |
Tel:(408)-986-8026, Fax:(408)-850-1910 |
http://www.mems-foundry.com |